Each release of a new generation of iPhone, makes us think about what will follow. And for the next versions, the powerful system signed by Apple could be updated with a major change. So, it was announced by the trusted analyst Apple, Ming-Chi Kuo, in a recent report.
According to Kuo, Apple “Aggressively” Tests Thermal Vapor Chamber Systems for Use on iPhones, which suggests that the technology will make its way to the flagship phone in the near future.
The next thing for the iPhone would be vapor chamber cooling technology.
The report believes that Apple is very likely to incorporate vapor chamber technology into an upcoming iPhone model, although it is not. it is clear if the system will be ready on time by 2021.
Since although this is not the first time that Apple has worked on this system for quite some time, early solutions did not meet the company’s high standards.
How does thermal steam technology work?
According to information published by Apple Insider, Vapor Chamber (VC) technology involves the evaporation of a liquid (usually water) in a specialized heat pipe or heat-retaining structure that makes its way through the chassis of an appliance.
Heat from processors and other high-load electronic components causes the liquid to evaporate into a vapor that diffuses thermal energy through the evaporator chamber as it moves to areas of lower pressure. The fins or other condenser bodies remove heat from the steam
Considering these advantages, Kuo states:
“The reason the iPhone does not adopt VC is that the reliability test results cannot meet Apple’s high demands… Nonetheless, we are optimistic about VC’s reliability improvement program and hope that at least high-end iPhone models will be equipped with VC in the near future.
Kuo believes the iPhone will need steam chambers to keep up with the rapid adoption of 5G and increasing CPU thermal loads. Since then, with the recent iPhone 12, it has been confirmed that they heat up when connected to the super-fast network. With which, an improved thermal system will increase computational performance and increase component longevity.