The processors known as the i9-9900K and its various versions are debating what to expect with the new Intel STIM. Temperature data collected by a number of media have revealed that the company may not have been working its compact well, so today we'll know better.
Intel STIM: welding upgrades come with controversy
It was not a good response from Intel to that offered by AMD, where forums and websites wanted to replicate the data provided by the company regarding developments in its structure. STIM is a dictionary of Solder Thermal Interface Material
This STIM has been evolving over the years and currently represents a series of high-value currencies with certain exact values that do not fit perfectly and should unite in different forms and components.
The i9-9900K model illustrates one of the problems that Intel has with STIM, since it has been mentioned in a small series that they are using between the disease and IHS. What few people know is that this STIM value is due to the increase in height that the deceased meant to install 8 cores and an iGPU without changing the total CPU of the socket and drying.
STIM Items
Intel has many of the best engineers in the world, not surprisingly, many of the features required to make STIM optional. Elements of its new structure are:
- Indian
- Titanium
- Nickel
- Vanadium
- Copper
In addition, other materials are needed to stabilize and maintain the bond between silicon and IHS, such as pure gold. As if that is not enough, the thickness of the layers determines the thickness of the material, not only when it cools, but by the movement of hot cycles.
The more intriguing question is whether Intel and AMD are really competing with their thermal combinations based on welds, which is really hard to know, since AMD didn't specify the materials.
So also if there is no exchange for these integrations in their IHS repositories, we should look at their implementation to know if you are actually better than the other.
As a general rule, AMD uses Intel's hottest interface, which also packs a lot more gold than its competitor.
This shows a high inconsistency between materials such as indium and nickel, so they need a gold-like material to achieve high heat transfer.
Intel instead uses very little gold, which allows us to see a much better working environment in terms of contact and disposal with silicon and nickel, which could indicate that its location has improved considerably and should therefore be more expensive (no official figures for this).