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The future of VRAM memory: DRAM 3DS vs HBM3

The Boss March 30, 2020 No Comments

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These days we are seeing how population growth impacts on huge data costs on servers and, therefore, resources are very limited. Investigations against the virus COVID-19 (or SARS-CoV-2) They claim the use of artificial intelligence centers and the HPC to try to find the gene sequences and chains that allow us to understand the strengths and weaknesses of the said virus.

In short, manufacturers' graphics cards and the FPGA are widely used these days, while in the game market now nothing has changed.

The future does not pass to GDDRX, it is competing with a new elite

HBM vs DRAM 3DS

Surprising as it may seem, the high performance market is not about replacing the GDDR memory on graphics cards. This can continue in the gaming market at their full low cost despite the high cost and low bandwidth, but in the high performance market and even for PC players of 4K @ 144 Hz this is not enough.

Bottlenecks continue to happen and the power of hips is growing more, so VRAM memory is lagging behind compared to GPUs.

3DS_die_stacking_concept_model

As predictors are, companies are currently exploring or launching in a new version of HBM such as HBM2E and in the competition with a newcomer who is slowly and promising to put himself first: DRAMA 3DS.

It is likely that this new version of VRAM will eventually face the new HBM3 in R&D, which promises to eliminate many sensitive tools for current and future platforms.

The battle will be between the DRAM 3DS and HBM3

DRAM-3DS

Not too much information about DRAMA 3DSIn fact, you may not end up calling such a trade. But what we do know is that marketers call the following type memory with three entries.

The idea is to defeat HBM and choose to install 16 or more stacks that are integrated as this will do, or are currently getting a few connections 4 stacks

. In any case, and although no quick stats or skills have been provided for its youth, if you want to compete with HBM3 with a performance per watt, you will have to offer a minimum transmission rate of 4 Gbps with 512 GB / s of bandwidth. band.

In addition, you will have to make it one year left, when this kind of memory comes to market to replace HBM2E to occupy the working throne. It will all depend on how TSMC uses 3D technology as its most advanced model CoWoS and most of all, when it comes to the market.

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Tags:3DS DRAM future HBM3 memory VRAM

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